iN-Cube High-Speed LED Chip Sorter is equipment designed for the semiconductor industry, mainly used for rearranging, sorting, and mixing LED chips of 3 mil and above. It works by scanning the wafer MAP and automatically match with the map file loaded from MES, and pick the chips with the same BIN No. onto the same Bin tape. Based on the optoelectronic parameters from the chip tester and the appearance inspection results from AOI, the LED chips are classified and assigned to different Bin carriers. The use of iN-Cube LED Chip High-Speed Sorter significantly enhances the production efficiency and classification accuracy of LED chips.
Core Process Flow:
1. Wafer ID Scanning and Physical Position Reading: Scans the wafer ID and reads the physical location of the chips.
2. MES System Download and Prior Process Map Call: Downloads and calls the map from prior processes, such as electrical testing Maps.
3. Map Merging: Merges the physical location of the chips with the electrical test Map.
4. Chip Sorting: Chips are sorted according to the Bin classification defined in the Map, with chips of the same Bin class placed on the same Bin membrane.
5. Chip Mixing: If necessary, wafer mix and Bin mix are carried out according to customer customization requirements.