Large Chip Sorting: Capable of sorting chips with a side length ranging from 0.5mm to 15.5mm
Wafer Inspection Compatibility: Supports incoming wafers with Disco ring specifications of 8 inches and 12 inches for inspection and sorting
Comprehensive AOI Inspection: Performs AOI inspection on the front, back, and all four sides of sorted chips
Defect Detection Based on Deep Learning and Traditional Algorithms: Utilizes deep learning for defect detection, with traditional algorithms providing additional support. Parameters can be freely adjusted for control
High and Stable Alignment Accuracy: Achieves XY alignment precision deviation of ≤25μm and angle deviation of ≤1°
High Efficiency: Continuous picking cycle time (CT) of less than 200ms for 3mm * 3mm chips
High Success Rate: Sorting success rate ≥99.99% (excluding visually defective products)
Optimal Map Sorting Logic: Balances production capacity and sorting accuracy to minimize the risk of "Wrong Sort."
Automatic Correction of Die Bonding Position Deviation: Automatically corrects deviations in the die bonding position
Fully Automated Wafer/Bin Loading and Unloading: Supports fully automated loading and unloading of wafers and bins
Non-Destructive Chip Pickup: Can pick chips without breaking the film, reducing product damage rate
High Cleanliness Level: Meets Class 10 cleanroom standards for dust control
Customizable Software Development: Supports customized software development for specific needs