The fast and reliable 12 inch Soft Solder Die Bonding System

Product Overview: The DA6008+ is a 12 inch fully automated, highly reliable soft solder placement system for Standard Power Packages, High Power Packages, Power ICs In the fields of Packages, Special High Power, and Intelligent Power (IPM), The chip is bonded to the frame with soft solder wire.

• High-speed standard indexer
  

• Soft high-speed indexer drive
  

• Indexer high-speed X-motion
  

• Suitable for different shapes of the power frame feeding mechanism
  

• Wafer processing capacity up to 12 inch, backwards compatible with 8cinch and 6inch wafers
  

• Frame conversion, switching kits
  

• Solder patterning technology
  

• Automatic teach-in function
  

• Machine vision technology
  

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： jian.mao@incubecn.com

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